02128nas a2200217   4500000000100000008004100001260001200042653002400054653001800078653002100096653001200117653001000129653002300139100001200162700001300174700001600187700001300203245010400216520157600320022001401896       2026                            d  c01/202610aattention mechanism10aDeep learning10aImage processing10aleprosy10au-Net10awound segmentation1 aMehta J1 aMishra S1 aMalvankar R1 aBorade S00aIntegrative Image Processing Framework for Enhanced Detection of Leprosy-Associated Chronic Wounds.3 a<p>Automated leprosy chronic wound analysis from smartphone-acquired images remains hindered by uneven illumination, indistinct lesion margins, and poor spatial-textural integration. The CO-WinF framework introduces three specialized modules: AINCE, which performs tile-adaptive contrast remapping guided by local intensity distributions and edge-preserving smoothing to restore fine lesion textures; MEPS, which executes simultaneous multi-resolution encoding within a U-Net backbone enhanced by gradient-driven attention to emphasize boundary transitions and ensure accurate segmentation of irregular wound contours; and HSTFC, which leverages attention-weighted fusion of deep spatial embeddings and handcrafted LBP and HOG texture histograms, followed by classification via a gradient-boosted ensemble optimized for class imbalance. Validation on the CO2Wounds-V2 dataset yields 94.98% precision, 95.78% recall, 93.10% F1-score, and 87.09% IoU, surpassing existing state-of-the-art approaches. By integrating localized enhancement, edge-aware segmentation, and hybrid feature fusion in a computationally efficient pipeline, CO-WinF delivers robust, interpretable diagnostic support in resource-constrained clinical environments. Key novelties include the tile-adaptive remapping within AINCE, the gradient-driven attention integrated at scales in MEPS, and the attention-weighted fusion of spatial and textural features in HSTFC. By addressing pre-processing and feature-level integration challenges, CO-WinF establishes a benchmark for smartphone wound analysis.</p>  a1552-6941